Dear colleagues,

This is to inform you that the “IEEE International Conference on Physical Assurance and Inspection on Electronics” (PAINE), is to be held “in-person” from November 12-14, 2024 in Huntsville, AL. PAINE is supported by the “Reliability Society” and accepted papers will be published in IEEE Xplore after peer review by the PAINE TPC.

PAINE offers an exciting venue to researchers and practitioners in the field of Hardware Security and Trust who research and develop physical assurance and analysis. PAINE brings together experts from government, instrumentation, original component manufacturers (OCMs), original equipment manufacturers (OEMs), and academic researchers together to share ideas and solutions to make electronic devices and systems safe and secure.

Topics covered are including but are not limited to:

• Security primitives: Novel devices, materials, and systems
• Trojans and backdoors: Detection and prevention
• Fault injection assessment and countermeasures
• Side-channel assessment (power, timing, EM) for assurance and countermeasures
• Analog & mixed-signal circuits and systems security
• FPGA Bitstream protection and vulnerabilities
• Emerging topics in physical inspection and assurance
• Counterfeit Detection and Anti-Counterfeit Technique
• Image analysis and artificial intelligence for assurance and inspection
• Novel material and devices for assurance
• Sample Preparation
• PCB trust and assurance
• Chip and PCB level decomposition for assurance
• FIB/SEM for assurance
• Electro-optical probing using PEM, EOP, EOFM, etc.
• Physical/side-channel fingerprinting
• Mod-chip on PCB
• Microprobing and nanoprobing
• Bus-snooping
• Field-based weakness
• Countermeasures against tampering and decomposition
• Physical/logical shielding etc.

CONTACT INFORMATION

Navid Asadi (General Chair)University of FloridaE-mail: nasadi [at] ece [dot] ufl [dot] edu

Christopher Bailey (Program Chair) Arizona State University

Best Regards,

PAINE Organizing Committee