Wire Bonding Failure Characterization of an IGBT Based Power Module Through Impedance Analysis

EasyChair Preprint 14852

Abstract

This study deals with the development of a wide-frequency-band characterization for failure analysis of power modules, focusing on a specific IGBT packaging. It is highlighted that different characteristics of the IGBT and the packaging can be distinguished depending on the frequency band analyzed, enabling the detection of potential failure modes. Particularly, for the power bond-wire lift-off mechanism, the paper emphasizes the importance of considering high-frequency analysis above 200 MHz. It is enabled through the definition of a failure indicator, demonstrating the ability to highlight partial failures as well as to localize them.

Keyphrases: Failure diagnostic, Failure indicator, RF characterization, Wide frequency band, power modules

@booklet{EasyChair:14852,
  author    = {Paul-Etienne Vidal and Stéphane Baffreau and Guillaume Viné and Anusha Gopishetti and Than-Long Le},
  title     = {Wire Bonding Failure Characterization of an IGBT Based Power Module Through Impedance Analysis},
  howpublished = {EasyChair Preprint 14852},
  year      = {EasyChair, 2024}}